Packaging Engineer

An exciting opportunity has arisen for a hands‑on MEMS Manufacturing Engineer to join an innovative deep-tech company developing next‑generation MEMS sensing technology.

This role will be instrumental in taking advanced MEMS devices from prototype development through to pilot‑scale manufacturing. Working closely with multidisciplinary engineering teams, you will develop assembly processes, optimise manufacturing workflows, improve yields, and support the transition from R&D into scalable production.

Key Responsibilities:

• Build and assemble MEMS‑based prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction (NPI) and manufacturing scale‑up activities.
• Work with external manufacturing, foundry and packaging partners as production grows.

Requirements:

• Degree in Engineering, Physics, Materials Science or a related discipline.
• 3+ years' experience within semiconductor, MEMS, photonics or advanced technology manufacturing.
• Experience with semiconductor packaging, die attach, wire bonding or precision assembly processes.
• Strong process development and problem‑solving skills.
• Experience developing manufacturing procedures and documentation.
• Comfortable working in a fast‑paced, hands‑on engineering environment.
• Cleanroom manufacturing environments.
• CAD design for fixtures and tooling.
• Reliability testing and failure analysis.
• Statistical Process Control (SPC).
• Wafer‑level or advanced semiconductor packaging.
• Working with foundries, OSATs or contract manufacturers.

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