Shift Semiconductor Process Engineer

Intellectual Capital Resources · Northampton, England ·

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Our international client is currently searching for a Shift Semiconductor Process Engineer to provide hands-on, shift-based engineering support across semiconductor fabrication and backend manufacturing, ensuring safe, stable and efficient production. Working a rotating 12-hour shift pattern (2 days, 2 nights, 4 days off), the role focuses on process control, troubleshooting, yield improvement, production recovery and new product introduction (NPI).

Technology areas may include lithography and e-beam lithography, dry and wet etching, thin-film and metal deposition, and backend wafer processing.

Key Responsibilities

Provide technical support to Manufacturing, troubleshooting process, product and equipment issues.

Monitor process performance using SPC, MES and manufacturing data systems, responding to abnormal conditions.

Investigate process excursions, identify root causes and implement containment, corrective and recovery actions.

Improve yield, quality, process capability, throughput, cycle time and cost.

Support process development, qualification, optimisation and NPI.

Apply SPC, DOE, Six Sigma, Lean and statistical methods to drive continuous improvement.

Escalate recurring or significant issues to relevant engineering teams and process owners.

Mentor Manufacturing personnel and ensure compliance with process controls, quality standards and health, safety and environmental requirements.

Education, Skills & Experience

Degree, postgraduate qualification or equivalent industrial experience in Semiconductor Technology, Materials Science, Physics, Chemistry, Engineering or a related discipline.

Experience in semiconductor, MEMS, silicon photonics or other advanced manufacturing environments.

Practical knowledge of one or more semiconductor processes, including lithography, etching, deposition, metallisation or backend wafer processing.

Backend experience in wafer mounting, thinning, back grinding, CMP, polishing, cleaving or dicing is highly desirable.

Understanding of SPC, DOE, Six Sigma, Lean Manufacturing and root-cause analysis.

Strong analytical, troubleshooting and problem-solving skills, with the ability to interpret process and equipment data.

Ability to work independently under pressure and collaborate effectively across multidisciplinary teams.

Good written and verbal communication skills, including technical documentation and knowledge sharing.

Please contact Rachel Anderson for further details.

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